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LBNE Long-Baseline Neutrino Experiment Document 3037-v1

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Wire Holding Tests for Liquid Argon TPC’s

Document #:
Document type:
technical note
Submitted by:
Hans Jostlein
Updated by:
Hans Jostlein
Document Created:
27 Oct 2010, 13:48
Contents Revised:
27 Oct 2010, 13:48
Metadata Revised:
27 Oct 2010, 13:48
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We have tested a large number of stretched Cu-Be wires, held with solder alone and with solder/epoxy.
We find that cu-Be wires of 6 mil diameter can be held with epoxy solder alone indefinitely if the shear stress on the wire surface is below 170 psi, limited by creep.
Higher stresses can be supported without significant creep if epoxy blobs are used in addition to the solder. We found, however, a large fraction of electric continuity failures within the epoxy if the boards were oven-cured at 60 C for two days. These failures are not understood.
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Referenced by:
  • LBNE-doc-4293: Wire holding in epoxy-- need FEA calculations
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